Parker Chomerics
Advanced EMI Shielding, Thermal Management & Engineered Materials Solutions
Parker Chomerics, a division of Parker Hannifin, is a global leader in the development and application of electromagnetic interference (EMI) shielding, electrical grounding and thermal interface materials for advanced electronic systems.
Combining expertise in material science, process technology and application engineering, Parker Chomerics provides innovative solutions that help protect sensitive electronics, manage heat, control electromagnetic interference and improve the reliability of increasingly powerful and compact electronic systems.
At MONILEK Oilfield, we bring Parker Chomerics technologies closer to customers across the UAE and Middle East, supporting applications across Data Centers, Energy, Defence, Transportation, Telecommunications, Life Science and Industrial Electronics.
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Thermally Conductive Gels
Discover which Parker Chomerics THERM-A-GAP GEL is best for your application. These single component dispensable thermal gap fillers require no curing and can be dispensed over a heat generating component for effective cooling. THERM-A-GAP GELs eliminate multiple thermal gap filler pad part sizes and their cross-linked gel structure provides superior long-term thermal stability and performance.
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Thermally Conductive Pads
Parker Chomerics THERM-A-GAP™ gap filler pads are a family of low soft, thermally conductive silicone and non-silicone elastomers for applications where heat must be conducted over a large and variant gap between a semiconductor component and a heat dissipating surface.
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Thermally Conductive Potting and Encapsulation
Parker Chomerics THERM-A-FORM™ thermally conductive compounds are two-component materials that require a cure and are used on complex geometries for cooling of multiple height heat generating components without the expense of molded sheets or gap pads.
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Thermally Conductive Electrical Insulator Pads
Parker Chomerics CHO-THERM Thermally Conductive Electrical Insulator Pads are designed for use where the highest possible thermal, dielectric, and mechanical properties are required.
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Thermally Conductive Phase Change Materials
Parker Chomerics THERMFLOW® phase-change Thermal Interface Materials (TIMs) effectively eliminate interfacial air gaps and voids. They also remove trapped air between electronic components that generate heat. These phase-change materials are engineered to optimize heat sink efficiency and enhance the reliability of components.
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Thermally Conductive Greases
Our thermally conductive greases are silicone-based, single component materials which conduct heat between a hot component and a heatsink or enclosure.
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Thermally Conductive Adhesive Tapes
Parker Chomerics THERMATTACH® tapes are formulated with acrylic or silicone based pressure sensitive adhesive (PSA) loaded with thermally conductive fillers. They are designed to securely bond heat sinks to power dissipating components without an additional clamping mechanism.
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Thermally Conductive Heat Spreaders
The Parker Chomerics range of thin heat spreaders offers a cost-effective solution for cooling IC devices in confined spaces where traditional heat sinks are unsuitable.